| 摘要 |
PURPOSE:To prevent halo phenomenon and quality scattering by a method wherein an oxidized copper membrane is formed on the internal layer surface to adhere a base metal thereto to reduce it by heating, and thereafter an internal layer material is used which is performed an alkali counteractive treatment at a predetermined temperature. CONSTITUTION:An electric circuit is formed on both surfaces of a glass cloth basic material epoxy resin laminated plate coated with copper on both surfaces having a thickness 0.8mm. Thereafter, an oxidized copper membrane is formed by a normal blacking treatment and coated with zinc powder to melt zinc with a vitriolic solution as well as reduce it. Thereafter, the reduced matter is performed an alkali counteractive treatment in a sodium hydroxide solution of 40 deg.C to obtain an internal layer material. Next, on the obverse and reverse surfaces of the internal layer material, through two sheets of glass cloth basic material epoxy resin prepreg each of a thickness 0.1mm, a laminated plate arranging a copper foil having a thickness 0.035mm is heated and pressurized for 90min. at a mold pressure 40kg/cm<2> and 160 deg.C to mold it. Thus, it is possible to obtain a multi-layer printed wiring board without halo phenomenon and quality scattering. |
