| 摘要 |
PURPOSE:To improve soldering strength of four corners of a package at the time packaging of a semiconductor device having an LCC-type package. CONSTITUTION:Connecting strength of four corners of a package at the time of packaging increases and resistance to stress due to torsion of a substrate is improved, by increasing the width of an electrode lead 12 provided at the edge of each side of an package among electrode leads 5 provided on peripheral sides of an LCC, compared with the width of other electrode leads 5. |
