| 摘要 |
PURPOSE:To prevent the deterioration of product yield due to exfoliation of a metal thin wire from a bonding part, and prevent the deterioration of product reliability due to insufficiency of adhesion between the metal thin wire and an inner lead, by performing bonding after each inner lead is compulsorily and elastically fixed by using a thin tube capable of expanding and contracting. CONSTITUTION:A lead frame 2 mounting a semiconductor element on a semiconductor element mounting part 3 is carried onto a bonding stage 9. A lead frame pressing-retaining arm 6 descends, and inner leads 4 are wholly pressed by a lead frame presser 5, and compulsorily and elastically fixed as the result of expansion of a fine tube 11 to which filling material is supplied from the side of a filling material transmitting part 13. After that, the bonding pad parts of a semiconductor element 1 and the inner leads 4 are bonded to specified positions by a bonding toll 16 with metal thin wires 15. Thereby all of the inner leads 4 can be surely fixed, and necessary force can be sufficiently transmitted to the bonding parts of the metal thin wires and the inner leads 4. |
