METHOD FOR SIMULTANEOUS FORMATION OF ELECTRIC CONDUCTIVE PATH,AND BONDING CHIP

摘要

PURPOSE: To provide a method of simultaneously making electrical connections at structurally different levels, without giving impacts to the integrity of package structure or the functionality of a device. CONSTITUTION: Electrical connection is made by placing an electrical conduction path 40, crossing at least two 16, 62 from among a plurality of electrical conduction lines and a plurality of electrical conduction pads to be connected electrically. Then a special bonding chip 50 is used, and both the ends of the electrical conduction path are thereby attached to at least the two 16, 62 from among the plurality of the electrical conduction lines and the plurality of the electrical conduction pads, simultaneously.