| 摘要 |
PURPOSE:To improve the water resistance and corrosion resistance for a connecting portion between a semiconductor chip and a lead by coating the whole surface of the semiconductor chip and a surface containing an electric connection between the semiconductor chip and an external leader line with water-resistive, corrosion resistant films and further sealing them with a hard type resin forming body. CONSTITUTION:Electrical bonding between an electrode 3 of a chip and a lead frame is made by a bonding wire 5. In the water resistant coat treatment, a solution of a soft high molecular material 7 with water resistance and corrosion resistance is applied to fully cover the whole surface of a semiconductor chip 1, a bonding portion between the bonding wire 5 and lead frame 4, and especially electrode 3. Then, water resistance-treated semiconductor chip is set in forming dies, the whole of the connecting portion with the chip bonding wire is surrounded and sealed with a packaging material 6 made of a hard thermosetting resin. By doing this, the corrosion of the connection between the semiconductor chip 1 and bonding wire 5 due to ingress of water can be prevented. |
