| 摘要 |
PURPOSE:To suppress the temperature increase caused by heat by providing a heat dissipating means between semiconductor elements or between the groups of a plurality of the piled semiconductor elements. CONSTITUTION:A lead frame 1 is smaller width than a semiconductor element 5a to be mounted and has a long and narrow shape and the frame is composed of a die pad 2a which is larger in area than the semiconductor element 5a and a plurality of leads 3. The semiconductor element 5a is mounted on the die pad 2a and an electrode 6 and the corresponding lead 3 are connected by wire 4. A plurality of the lead frames 1a-1d whose electrode 6 is connected with the lead 3 by the wire 4 are piled in the vertical direction and the die pads 2a-2c and the semiconductor elements 5b-5d are integrally bonded by polyimide adhesive 7. The die pads 2a-2d operate as heat dissipating means and since the area is large, heat dissipation is promoted, the temperature increase of the multi-tip module is suppressed and the performance of the module is not influenced. |
