LOW TCE POLYIMIDES AS IMPROVED INSULATOR IN MULTILAYER INTERCONNECTED STRUCTURES

摘要

Multilayer high density interconnect structures for use in semiconductor devices or packages comprise a substrate having at least one conductive feature therein, a film of a low thermal coefficient of expansion, low stress, low dielectric constant polyimide composition adhered to the substrate, and at least one interconnective conductive feature in contact with the conductive feature in the substrate and being disposed in the film of polyimide.