DICING-DIE BONDING FILM

摘要

A dicing-die bonding film comprising an ultraviolet-transmitting substrate (1) having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer (2) and an adhesive layer (3) in this order, the pressure-sensitive adhesive layer having been partly ultraviolet-cured to have cured parts (2') and uncured parts. The film has a well-balanced combination of a holding power for supporting a semiconductor wafer during dicing and release properties for enabling cut chips to be easily released together with the adhesive layer so that even large-sized chips as larger than 10 mm x 10 mm can easily be picked up.