发明名称 COMPOSITE PREPREG
摘要 PURPOSE:To enhance the work to which a prepreg is related among the combination works of constitutional materials in the production of a laminated sheet and a multilayered printed wiring board and to reduce a resin powder scattered from the prepreg. CONSTITUTION:A plurality of superposed prepregs are bonded at the peripheral end edges thereof under heating and pressure to form a composite prepreg. In the composite prepreg 4 for a pin laminate type multilayered printed wiring board, the peripheral parts 2 of pinholes 1 are bonded under heating and pressure.
申请公布号 JPH05200739(A) 申请公布日期 1993.08.10
申请号 JP19920011453 申请日期 1992.01.27
申请人 HITACHI CHEM CO LTD 发明人 NAKANO NAOKI;IWAKURA MASAMI;SHINKO TOYOTARO
分类号 B29B11/00;B29B15/10;B29K105/06;B32B3/02;B32B5/28;B32B15/08;H05K3/46 主分类号 B29B11/00
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