发明名称 Method for forming variable width isolation structures
摘要 An isolation structure as well as a method for using and fabricating an isolation structure in an active layer deposited on a substrate the method of fabrication including the steps of forming a buried oxide layer in the active layer adjacent the substrate, forming an isolation trench in the active layer by etching at least up to and optionally into the substrate, forming a dielectric isolation layer on the exposed surfaces of the trench, removing the dielectric isolation layer from the bottom of the trench, and forming an isolation structure by epitaxially growing monocrystalline silicon in the trench.
申请公布号 US5234861(A) 申请公布日期 1993.08.10
申请号 US19910668013 申请日期 1991.03.12
申请人 HONEYWELL INC. 发明人 ROISEN, ROGER L.;RAHN, CURTIS H.;STRAIGHT, JOHN B.;LIU, MICHAEL S.
分类号 H01L21/763 主分类号 H01L21/763
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