发明名称 MANUFACTURE OF AROMATIC POLYAMIDE IMIDE RESIN MOLDING
摘要 PURPOSE:To obtain the titled resin molding useful for industrial material or the like stably free of deficiency such as cracking and peeling by performing a compression molding of an aromatic polyamide imide resin below a melting temperature after a thermal treatment thereof in an inert gas on a specified condition prior to the molding. CONSTITUTION:In the compression molding of an aromatic polyamide imide resin below the melting temperature thereof, the resin undergoes a thermal treatment in an inert gas on the condition to meet the formula I [where, (t) represents the thermal treatment time in time unit and T thermal treatment temperature in deg.C that is 300 deg.C<=T<=410 deg.C] prior to the molding to obtain a desired resin molding. It is preferable that the aromatic polyamide imide resin comprises single repeated units as shown by the formula II and the thermal treatment temperature is 340-390 deg.C.
申请公布号 JPS59230713(A) 申请公布日期 1984.12.25
申请号 JP19830107339 申请日期 1983.06.14
申请人 SUMITOMO KAGAKU KOGYO KK 发明人 UENO SHIYOUJI;NAGAOKA KENJI;MIYASHITA AKIRA;HIRUKO SATOSHI
分类号 B29C33/00;B29B13/02;B29C43/00;B29C43/32;B29C43/52;B29C43/58;(IPC1-7):B29C3/00 主分类号 B29C33/00
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