| 摘要 |
A dual curing composition is prepared from components consisting essentially of (a) an isocyanate adduct having (i) free isocyanate groups and (ii) free photopolymerizable ethylenically unsaturated groups, wherein the ethylenically unsaturated groups comprise in the range of 10 to 70% of the total of any free functional groups on said adduct; (b) reactive (meth)acrylate diluents; and (c) optionally, photoinitiator. When cured, the above composition is particularly suitable as a conformal coating on electronic circuit boards.
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