| 摘要 |
A system of assembling devices to substrates is disclosed. A pattern of lines and/or dots of bonding medium is formed on a substrate to provide a uniform support for the device. Apparatus and a method for applying the bonding medium to the substrates is also disclosed. The bonding medium is applied to the substrates with transfer surfaces formed on a movable tool. The transfer surfaces are formed in a configuration that matches a desired pattern of the lines and/or dots of the bonding medium. Also, an assembly method is disclosed in which devices are pressed onto the adhesive lines and/or dots with an assembly tool that is moved with a precisely controlled force. In addition apparatus and a method of curing an adhesive interface between the assembled devices and substrates is disclosed. Use of the curing apparatus and method limits any relative lateral movement between the devices and the substrates during curing.
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