| 摘要 |
<p>PURPOSE:To conquer the defect of the increase of warpage when a thin plastic sheet is used as a cover panel though a heat-sensitive adhesive sheet has been used for laminating each member of an IC memory card. CONSTITUTION:Heat-sensitive adhesive sheets 9, 9' are used for laminating cover panels 6, 6', and a pressure-sensitive adhesive sheet 8 is employed for laminating a circuit board 2, a frame 14 and a spacer 5. Accordingly, an IC memory card abounding in adhesive strength and having excellent flatness can be acquired without changing a conventional IC-card manufacturing process.</p> |
