发明名称 Transient liquid phase ceramic bonding
摘要 Ceramic and metal articles are joined using three metal layers one of which is a refractory metal or alloy. The refractory metal layer is placed between the other two layers, which each include a metal or alloy having a lower melting point than the refractory metal layer. The three metal layers are pressed between two articles to be bonded to form an assembly. The assembly is heated to a bonding temperature, at which the refractory metal layer remains solid, but the other two layers melt to form a liquid. The assembly is held at the bonding temperature. The refractory metal layer dissolves in surrounding liquid and a single solid bonding layer is eventually formed, at the bonding temperature, between the two articles. The bonding method may be referred to as a transient-liquid-phase or isothermal bonding method.
申请公布号 US5234152(A) 申请公布日期 1993.08.10
申请号 US19920817540 申请日期 1992.01.07
申请人 REGENTS OF THE UNIVERSITY OF CALIFORNIA 发明人 GLAESER, ANDREAS M.
分类号 B23K20/02;B23K20/16;B23K35/00;C04B37/00;C04B37/02;F28F21/04 主分类号 B23K20/02
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