| 摘要 |
<p>PURPOSE:To firmly bond particles mainly composed of nickel to each other for preventing the separation thereof, and stabilize the quality of a metal substrate by coating the metal particles with metal having a lower melting point than the nickel, and processing the coated particles as multilayer particles. CONSTITUTION:A copper film 3 is applied to the surface of metal particles 2 mainly composed of nickel, using a means such as a plating process and a surface reforming device, thereby forming multilayer particles 4. These particles 4 are applied to the surface of a nickel substrate 1. Then, the substrate 1 is subjected to pressing and molding processes. As a result, the copper film 3 is deformed and a film having high adhesion among the adjacent multilayer particles 4 can be obtained. This film is heated in reducing atmosphere. Due to this heating process, the copper having a lower melting point than the nickel first melts, and the particles 4 are bonded to each other. Concurrently, the particles 4 are bonded to the substrate 1. After forming a diffusion layer 5, the copper is removed via evaporation from the layer 5 due to heating, and a porous nickel layer 6 remains. As a result, nickel particles are firmly bonded to each other via the layer 6, and a porous metal substrate 7A of stable quality free from the separation of the particles can be provided.</p> |
