| 摘要 |
<p>PURPOSE:To realize a thinner package, thereby to provide a higher packaging- density semiconductor integrated circuit by preventing the contact between bus bars and bonding wires. CONSTITUTION:A semiconductor integrated circuit comprises bus bars 2 arranged inside inner leads 1, a semiconductor chip 4 fixed on the inner leads 1 and the bus bars 2 through an insulator 3, bonding wires 6 passing over the top of the bus bars 2 and connecting bonding pads 5 of the semiconductor chip 4 and the inner leads 1 through an opening which is provided inside the bus bars 2, and insulating coated films 7 and 7a which are formed by insulating bonding agent coated on the top of the bus bars 2.</p> |
