| 摘要 |
PURPOSE:To perform the sheet type annealing of wafers by providing a wafer adsorption chuck for a wafer pick-up mechanism for picking up semiconductor wafers from a wafer cassette one by one. CONSTITUTION:A wafer is adsorped from a wafer cassette on a feed-side cassette table 1 by a chuck of the end of a pick-up arm 3 and is put on a heater 5 for heating the circumferential part of the wafer and the wafer is introduced into an annealing furnace, where the wafer is heated by infrared rays from above and below to be annealed. After annealing, the wafer is cooled compulsorily in the part of a duct 11 of a furnace opening by an N2 gas blown off from a nozzle 12. After that, the wafer is taken out and is adsorbed by the chuck again and is contained in a wafer cassette on an accept-side cassette table 2. |
