| 摘要 |
PURPOSE:To improve reliability by preventing the generation of a crack in solder through reducing thermal stress and displacement generated in a solder joint. CONSTITUTION:When a lead 11 is caused to protrude out of sealing resin 6 from the position of which the height from a mounting substrate exceeds the center of the sealing resin 6; the height dimension of an outer lead can be made larger without increasing the height dimension of the whole device. |
