发明名称 METHOD OF MOUNTING ELECTRONIC ELEMENT TO SUBSTRATE AND ELECTRIC DEVICE THEREOF
摘要 <p>PURPOSE: To provide a method for efficiently attaching an electronic element such as a flat, ductile insulating substrate capacitor for mounting conducting material. CONSTITUTION: One conducting side 14b of an electronic element 14 is brought into electrical contact with a conducting material of a substrate and attached to a specified region of a substance. A slot of less than 360 degrees is cut around the electronic element, and a tongue portion 22a including the electronic element and a hinge portion 24 as an internal unit with the substrate are formed. The tongue portion is bent around the internal hinge portion and extruded to the outside out of the plane of the substrate. Thus, the electrode element is moved to the intended position together with the tongue portion, and the conducting part at the opposite side of the electronic element is connected to a suitable terminal.</p>
申请公布号 JPH05198914(A) 申请公布日期 1993.08.06
申请号 JP19920113102 申请日期 1992.04.06
申请人 MOLEX INC 发明人 TEIMOSHII AARU POON
分类号 H01R13/719;H05K1/18;H05K3/32;H05K9/00 主分类号 H01R13/719
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