发明名称 |
SEALING METHOD FOR LIGHT EMITTING DIODE ELEMENT |
摘要 |
PURPOSE:To easily manufacture a light-emitting diode sealed with clear or dyed resin with high productivity and with no internal distortion, no crack, no discoloring and small intensity deterioration. CONSTITUTION:A method for sealing a light emitting diode element comprises the steps of burying the element in sealing ultraviolet ray curable resin composition filled in a vessel, and moistening the element with chip coating ultraviolet ray curable resin composition before curing it with an ultraviolet ray. |
申请公布号 |
JPH05198845(A) |
申请公布日期 |
1993.08.06 |
申请号 |
JP19920020727 |
申请日期 |
1992.01.10 |
申请人 |
NIPPON KAYAKU CO LTD;HAISOOLE KK |
发明人 |
KUDO SHOJI;KUNIKATA KENJI |
分类号 |
H01L21/56;H01L23/29;H01L23/31;H01L33/50;H01L33/54;H01L33/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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