发明名称 SEALING METHOD FOR LIGHT EMITTING DIODE ELEMENT
摘要 PURPOSE:To easily manufacture a light-emitting diode sealed with clear or dyed resin with high productivity and with no internal distortion, no crack, no discoloring and small intensity deterioration. CONSTITUTION:A method for sealing a light emitting diode element comprises the steps of burying the element in sealing ultraviolet ray curable resin composition filled in a vessel, and moistening the element with chip coating ultraviolet ray curable resin composition before curing it with an ultraviolet ray.
申请公布号 JPH05198845(A) 申请公布日期 1993.08.06
申请号 JP19920020727 申请日期 1992.01.10
申请人 NIPPON KAYAKU CO LTD;HAISOOLE KK 发明人 KUDO SHOJI;KUNIKATA KENJI
分类号 H01L21/56;H01L23/29;H01L23/31;H01L33/50;H01L33/54;H01L33/56 主分类号 H01L21/56
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