| 摘要 |
PURPOSE:To obtain a method for detecting a bend of a lead of a chip component which makes it possible to check the bend of the lead in various modes without fail. CONSTITUTION:The respective center points of a plurality of leads 1 prided in projection in the periphery of a chip component W1 are determined by an image processing, relative distances PiA and PiB of the leads 1 to the lead one serving as a reference are determined, it is checked whether or not these distances are within a prescribed range, and thereby a bend of the lead is detected. In regard to the chip component of which the leads 1 expand outward as a whole although pitches between the adjacent leads 1 are within prescribed ranges respectively, the bend of the leads 1 can also be detected without fail by checking a cumulative pitch error of the leads 1, since the relative distances PiA and PiB of the leads 1 from the reference lead 1 are checked. |
