| 摘要 |
The invention relates to a process for manufacturing a memory card comprising a micromodule (1) including an integrated circuit (2), read/write contacts (5) carried by an insulating film (4), conductors (6) connecting the integrated circuit electrically to the read/write contacts, and an insulating resin (7) applied to the insulating film in such a way that it encapsulates the integrated circuit and the conductors. This process is characterised in that it consists in fixing to the insulating film (4) a cover (10) shaped so as to shroud the insulating resin (7), in fashioning, inside the card, a cavity (12) whose configuration corresponds to that of the assembly formed by the integrated circuit (2) and the cover (10), and in fixing this assembly into the cavity (12), the read/write contacts (5) being coplanar with the face of the card into which the cavity (12) emerges whilst the cover (10) bears against the bottom (13) of the cavity. <IMAGE>
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