METHOD AND DEVICE FOR CHANGING FUNCTION OF INTEGRATED CIRCUIT MODULE

摘要

PURPOSE: To provide a method and device for technology change with a module or a circuit outside of it, with no extra use of a surface region of an integrated circuit module. CONSTITUTION: For technology change in the circuit connected to an IC module 10, additional discrete electric part or circuit chip may be required. The technology change is performed on a small printed circuit board or a card 12, physically attached on the upper surface of the IC module. An EC pad 22 on a printed circuit EC card is juxtaposed, with an input/output pin 26 of an IC module which requires technology change. Then, a short fly wire 24 is soldered between EC pads and input/output pins that are juxtaposed to electrically connecting the EC card with the module.