| 摘要 |
<p>PURPOSE:To prevent deviations of coordinate positions of semiconductor chips when the chips adhered to an expansion sheet are picked up by lifting the sheet from its rear surface. CONSTITUTION:After a reinforcing sheet 4 made of synthetic resin having smaller stretchability than that of an expansion sheet 2 such as polyester resin, etc., is adhered to a rear surface of the sheet 2 after it is extended, semiconductor chips 3 are picked up by lifting the sheet 2 from its rear surface side.</p> |
