MANUFACTURE OF RESIN MOLDING

摘要

PURPOSE:To provide an easier process of resin molding and better reliability for the products by setting a basic plate with the movable positioning pins inserted into the through-holes in the specified position inside the mold and pushing down the pins just before the completion of injection molding to achieve an integrated molding. CONSTITUTION:PCB2 with IC module is placed in the specified position of lower mold 12 with the movable pin 15 inserted into the through hole 2a of PCB2. Since the movable pin 15 is pressed by the specified pressure with the spring 16, the printing base plate with IC module (PCB)2 is stationed in the specified position in the mold during the initial period of injection molding. Just before the completion of injection molding, the pressure inside the mold is raised up to actuate the spring 16 and push the movable pins 15 down to the same level of the surface of lower mold 12 until the pins hit the stoppers 17 and stop. Thus the resin is filled into the through holes 2a of PCB2 in which the movable pins 15 was inserted before being pushed down to achieve an integrated molding of PCB2 with IC module.