| 摘要 |
Described is a method of improving the heat-insulation properties of Cu/I-based polyamide using systems containing 0.1 to 1.0 % by wt. of quaternary phosphonium iodides which cannot be easily washed out. After rinsing and dyeing, filaments produced by this method exhibit a loss in tear strength, determined in an 8 h/177 DEG test, of less than 17 % relative to untreated fibres. In addition to filaments, the method is suitable for use with fibres, sheets and moulded articles. |
