| 摘要 |
A lead frame (5), used for constructing a multi-core optical module or the like, includes a frame portion (5B), a plurality of a substrate portions (5A) on which electronic circuit elements are to be mounted, and a support portion (5C) for supporting the plurality of substrate portions (5A) to the frame portion (5B). The support portion (5C) has a plurality of separated end portions connected to the respective substrate portions (5A) at the position where a molded resin member (P) is covered, and at least two of the plurality of end portions are combined into one body to be connected to the frame portion (5B) at the position where the molded resin member (P) is not covered. <IMAGE> |
