| 摘要 |
<p>An indicator of solder wave soldering parameters, comprising a simulating board to be passed by the soldering machine conveyor along the solder wave; and the board is provided with a plurality of contact orifices. This plurality is divided into several groups of orifices, which groups are placed on different sections of the board, and these different sections have different thicknesses. Eeach of the groups of the orifices is electrically connected to a corresponding timer. When the simulating board is moved along the solder wave, the groups of contact orifices come into contact with the solder wave according to their height level relating to the solder wave's height and hence relating to the depth of penetration of the solder wave into these contact orifices. Therefore the duration of the contact between the specific group of contact orifices and the solder wave can be measured as the corresponding dwell time for the specific depth of penetration of the solder wave into the specific group of contact orifices. <IMAGE></p> |
