发明名称 Semiconductor device substrate and process for producing the same.
摘要 <p>A process for producing a semiconductor device substrate comprises the steps of making a first substrate member porous, forming an insulating layer on a second substrate member, forming an amorphous layer on the insulating layer on the second substrate member, bonding the porous first substrate member to the amorphous layer at a temperature of an atmosphere in which the amorphous layer at least does not crystallize, causing solid-phase epitaxial growth of the amorphous layer by utilizing the porous first substrate member as crystal growth seed, and removing the bonded first substrate member after completion of the epitaxial growth by chemical etching.</p>
申请公布号 EP0553855(A2) 申请公布日期 1993.08.04
申请号 EP19930101416 申请日期 1993.01.29
申请人 CANON KABUSHIKI KAISHA 发明人 SAKAGUCHI, KIYOFUMI;YONEHARA, TAKAO;NISHIDA, SHOJI
分类号 H01L21/02;H01L21/20;H01L21/306;H01L21/762;H01L27/12 主分类号 H01L21/02
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