TAPE AUTOMATED BONDING IN SEMICONDUCTOR TECHNIQUE

摘要

A tape useful for an automatic bonding process when manufacturing a high-frequency semiconductor device, the tape comprising an insulating flexible film (2), and circuit patterns (3) consisting of copper or copper-alloy formed on the insulating film, each of the circuit patterns having inner (12) and and an outer lead portions (13). A tin or tin-lead plated film (16) is formed on the pattern, and an intermediate plated film is formed on at least the outer lead portion as an underlayer. The intermediate plated film consists of a metal or metal alloy selected from nickel, cobalt, gold, silver, platinum, palladium, indium or rhodium.