发明名称 THERMOPLASTIC RESIN FILM PROVIDED WITH VAPOR DEPOSITION LAYER
摘要 PURPOSE:To enable formation of a vapor deposition layer having excellent adhesion property by forming a metal vapor deposition layer on a thermoplastic resin film containing a specified amt. of polyolefinic resin consisting of olefin structural unit, acrylate structural unit and maleimide structural unit with a specified proportion. CONSTITUTION:A metal Al, Au, Ag, Cu, Zn, Sn, etc., is vapor deposited to 10-50nm thickness on a thermoplastic resin film containing 0.3-50wt.% polyolefinic resin and polyolefinic copolymers. Molecules of these polyolefinic resin and copolymers have 1000-50000 weight average mol.wt. and consist of 50-98mol% olefin structural unit expressed by formula I, 1-15mol% acrylate structural unit expressed by formula II, and 1-35mol% maleimide structural unit expressed by formula III or IV, linearly and irregularily arranged. The obtd. film has excellent antistatic property and extremely large adhesion property between the base film and the vapor deposition layer so that it is suitable for various packaging materials for which small oxygen passability and low gas passability of a film is required.
申请公布号 JPH05195202(A) 申请公布日期 1993.08.03
申请号 JP19920007947 申请日期 1992.01.20
申请人 TORAY IND INC 发明人 KAMIJUKKOKU SHIGEO;OHASHI KENJI
分类号 B32B7/04;B32B15/08;B32B15/085;C08F210/00;C08J5/18;C08L101/00;C23C14/20;C23C26/00 主分类号 B32B7/04
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