| 摘要 |
PURPOSE:To improve treatment efficiency by simplifying a treating stage and eliminating the conventional resist removal treatment. CONSTITUTION:This plating method has a surface roughening stage for roughening the surface of a resin as a nonconductive material, a metal nucleus imparting stage for subjecting the nonconductive material having the roughened surface to a metal colloid treatment to impart metal nuclei thereto, a film forming stage for forming a triazine thiol film on the nonconductive material imparted with the metal nuclei, a photoirradiation state for masking the required part of the surface formed with the triazine thiol and irradiating the surface with light and a plating stage for subjecting the surface to an electroless plating treatment thereafter. The photopolymerized film of the triazine thiol is formed on the surface of the nonconductive material, by which the plating deposition on the photoirracliated surface is suppressed and the selective plating on the part not irradiated with the light is enabled.
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