发明名称 |
METHOD FOR FORMING RIGID JOINT BETWEEN COPPER LAYER AND ALUMINUM OXIDE CERAMIC |
摘要 |
A process for preparing a firm bond between copper layers and aluminum oxide ceramic without coupling agent layers wherein the aluminum oxide ceramic is subjected to a plasma etching process in a first vacuum chamber in the presence of oxygen and immediately thereafter plated with copper by sputtering in a second vacuum chamber. |
申请公布号 |
JPH05194065(A) |
申请公布日期 |
1993.08.03 |
申请号 |
JP19920243606 |
申请日期 |
1992.09.11 |
申请人 |
HOECHST AG |
发明人 |
BERUNHARUTO HOFUMAN;HARUTOBUIIKU GERUNOOTO |
分类号 |
C04B35/111;C04B41/88;C04B41/91;C23C14/02;C23C14/18;C23C14/34 |
主分类号 |
C04B35/111 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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