| 发明名称 |
Balanced capacitance lead frame for integrated circuits and integrated circuit device with separate conductive layer |
| 摘要 |
A lead frame (10) is connected over an integrated circuit (40) by adhesives (42) and (44). Each lead conductor (16) and (18) of the lead frame (10) has the identical geometric area in order to provide identical capacitances. A metal shield may be provided on adhesives (42) and (44) to provide noise shielding for the integrated circuit (40).
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| 申请公布号 |
US5233220(A) |
申请公布日期 |
1993.08.03 |
| 申请号 |
US19920840563 |
申请日期 |
1992.02.24 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
LAMSON, MICHAEL A.;HEINEN, KATHERINE G. |
| 分类号 |
H01L23/495;H01L23/552;H01L23/58 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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