发明名称 METHOD OF MANUFACTURING SEAMLESS STRIP LOOP AND WIRE LOOP AND ITS DEVICE, USE OF SAID LOOPS AS CUTTING TOOL OF BAND SAW AND WIRE SAW
摘要 PURPOSE: To precisely cut and remove a thin disk from ingot or a rod made of a hard and brittle material by forming a metal ring into a rolled starting ring and by developing the starting ring into a thin band loop by cold rolling. CONSTITUTION: A seamless metal ring is prepared and the metal ring is remade into a rolled starting ring 4. Secondly, the starting ring 4 is developed into a thin band loop 5 by cold rolling using a rolling machine composed of work rolls 7a, 7b, auxiliary rolls 8a, 8b, and a support roll 9. According to circumstances, the band loop 5 is divided into narrow band loops or wire loops. The band loop or the wire loop is covered with a cutting film. The band loop and the wire loop manufactured in this way are used as cutting tools is a band saw and a wire saw.
申请公布号 JPH05192816(A) 申请公布日期 1993.08.03
申请号 JP19920145043 申请日期 1992.05.12
申请人 WACKER CHEMITRONIC GES ELEKTON GRUNDSTOFFE MBH 发明人 DEIITAA ZAIFUERUTO
分类号 B21D53/14;B21B5/00;B21H7/00;B23D65/00;B28D5/04 主分类号 B21D53/14
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