发明名称 |
METHOD AND APPARATUS FOR PERFORATING A PRINTED CIRCUIT BOARD |
摘要 |
A method for perforating a printed circuit board on two perforating position identifying patterns using two perforating devices which have respective coordinate systems, wherein the two patterns are imaged by TV cameras. The pattern positions are detected by an image processing device with image signals. An inter-pattern spacing is calculated based on the detected values of the pattern positions, using an arithmetic circuit. An error between an inter-perforating-hole spacing and an inter-pattern spacing is calculated. Perforating positions are calculated from the patterns by the arithmetic circuit. A perforating control circuit controls the two perforating members to perforate at the printed circuit board at the same time.
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申请公布号 |
US5233536(A) |
申请公布日期 |
1993.08.03 |
申请号 |
US19910675372 |
申请日期 |
1991.03.26 |
申请人 |
SEIKOSHA CO., LTD. |
发明人 |
ARAKI, MASATOSHI;OKUDA, KIYOSHI |
分类号 |
B23Q17/24;B23B41/00;B23B49/00;B26D5/34;B26D7/01;G01B11/03;G03F9/00;G05B19/402;H05K1/02;H05K3/00 |
主分类号 |
B23Q17/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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