| 摘要 |
A container is described which is useful for handling, storing, and shipping various packaged circuits (e.g., integrated circuits) including dual-in-line plastic (DIP) packages and dual-in-line ceramic (DIC) packages. The containers have a hump like structure shaped to accommodate the dual-in-line packages and have a conducting strip along each side of the container. With the container in an open position, the packages are free to slide along the hump-like structure which facilitates loading and unloading packaged circuits. When the container is in a closed position, the conducting strips press against the pins of the packaged circuits providing electrical contact between each pin in a row and holding the circuit packages securely in place. The containers provide excellent protection against damage from electrical discharge, are extremely convenient for loading and unloading packaged circuits, and are relatively inexpensive.
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