| 摘要 |
This invention relates to a semiconductor device package, comprising a carrier body which is to be mounted with a semiconductor device chip and which has an annular adhesion layer formed thereon, a cap which is to be adhered to the carrier body to hermetically seal the carrier body, and an adhesive applied between the adhesion layer of the carrier body and the cap and hardened after at least one of the carrier body and the cap is pivoted to be coaxial with the adhesion layer. With this arrangement, voids can be eliminated from the adhesive, and a sealing property of the package can be improved. |
