Discrete fabrication of multi-layer thin film, wiring structures

摘要

A multilayer, three-dimensional wiring matrix is fabricated from a plurality of individually testable plane pair sub-units (30). Each of the plane pair sub-units (30) includes a compensator (20) with capping layers (32) laminated on either side. The compensator (20) has a dielectric (14) encapsulated foil (10) which has been patterned with holes (12). Metallization patterns on the surfaces of the compensator (20) provide orthogonal wiring (22), electrical connections (24) to the foil (10), and electrical connections (26) between the top and bottom surfaces. The capping layer (32) includes joining metallurgy (38) at selected locations within a dielectric layer (36) that is in registry with the metallization in the vias (16). The joining metallurgy (38) may be a metal loaded thermoplastic and provides a seal for the vias (16) as well as planarizes the structure. The capping layers (32) may be formed in-situ on the compensator or separately.