| 摘要 |
A method of fabricating a lead frame inner connection assembly includes forming a lead frame having conductive fingers with inner lead ends connected to an electronic component, such as an integrated circuit die. Fluid-soluble alignment bars are deposited and cured within the areas between the conductive fingers. Preferably, the alignment bars are water soluble and are deposited using silk screen techniques. In a subsequent step of encapsulating the electronic component and inner lead ends, the alignment bars function as dams to prevent the flow of material beyond the desired extent of the encapsulation. At the ends of the alignment bars opposite to the electronic component a molded carrier ring may be formed, with the alignment bars again acting as dams to limit the flow of material. Conductive material can be contained within fluid-soluble material, thereby providing some degree of electrical connection between adjacent conductive fingers via the alignment bars. |
