发明名称 Electroless composite plating bath and method
摘要 A composite film consisting of particles of fibers dispersed in a metal matrix and formed by electroless deposition can be improved in appearance and particle or fiber content by adding a water-soluble amine or ammonium salt to the electroless plating bath. Preferably the bath contains a water-soluble nickel or cobalt salt, a hypophosphite reducing agent, a chelating agent for chelating the nickel or cobalt ion, a surface active agent, water-insoluble particles or fibers typically of polytetrafluoroethylene, and the water-soluble amine or ammonium salt.
申请公布号 US5232744(A) 申请公布日期 1993.08.03
申请号 US19910658660 申请日期 1991.02.21
申请人 C. UYEMURA & CO., LTD. 发明人 NAKAMURA, TAKAYUKI;CHIBA, TADASHI
分类号 C23C18/36 主分类号 C23C18/36
代理机构 代理人
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