发明名称 RESIN-SEALED ELECTRIC OR ELECTRONIC COMPONENT
摘要 PURPOSE:To obtain the subject resin sealed with a polyphenylene resin and excellent in adhesion to metal such as a lead wire. CONSTITUTION:This component is the one sealed with a polyphenylene resin composition comprising 100 pts.wt. polyphenylene sulfide resin, 1-15 pts.wt. copolymer mainly consisting of a polyamide component and a polyether component, having a content of the copolymerized polyether component of 50-90wt.% and a relative viscosity etar (at 25 deg.C in a o-chlorophenol solvent in a concentration of 0.005g/ml) of 1.7 or above, and 0-400 pts.wt. fibrous and/or nonfibrous fillers.
申请公布号 JPH05194853(A) 申请公布日期 1993.08.03
申请号 JP19920278725 申请日期 1992.10.16
申请人 TORAY IND INC 发明人 ISHIO ATSUSHI;KOBAYASHI KAZUHIKO;KAWAMURA TSUKASA
分类号 C08K3/00;C08K7/04;C08L81/02 主分类号 C08K3/00
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