发明名称 SUBSTRATE SUCTION APPARATUS
摘要 <p>PURPOSE:To correct even a substrate having a large warp and to surely suck and hold the substrate. CONSTITUTION:A suction part 2 is formed at the tip of a conveyance part. Suction ports 2a, 2b, 2c, 2d are formed in the suction part 2; the suction part 2 can be moved to a direction perpendicular to the suction face S of a substrate 5 by means of a drive part 201. The suction part 2 which ban be moved can come into contact with the substrate 5 even when the warp of the substrate 5 is large; in addition, it can be corrected so as to match the shape of the suction face S of the substrate 5. As a result, suction holes 4 can suck and hold the substrate 5 in sufficiently large areas.</p>
申请公布号 JPH05190414(A) 申请公布日期 1993.07.30
申请号 JP19920006408 申请日期 1992.01.17
申请人 NIKON CORP 发明人 SHIRASU HIROSHI
分类号 B25J15/06;B65G49/07;H01L21/027;H01L21/68;H01L21/683 主分类号 B25J15/06
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