| 摘要 |
PURPOSE:To contrive the improvement of the heat resistance and adhesion of a multilayer printed wiring board and to prevent a haloing or the like from being generated by a method wherein the metallic surface of a double-side metal-clad laminated board is subjected to electrical etching in a prescribed depth and after a metal plating treatment and a silane coupling agent treatment are performed, an internal layer circuit board formed with a circuit, a bonding sheet and an external layer metal foil are laminated and are formed integrally. CONSTITUTION:The surface of a double-side metal-clad laminated board is roughened mechanically by a buff or other polishing material as a pretreatment of an electrical etching and a pickling and a degreasing of the surface are performed. Then, the electrical etching is performed on the metallic surface of the laminated board on a prescribed condition and a metal plating treatment and a silane coupling agent treatment are performed. Here, it is desirable that the depth of treatment of the metallic surface is 0.5 to 10mum. When the depth of treatment is less than 0.5mum, the sufficient adhesive force of the surface is not obtained and when the depth exceeds 10mum, the accuracy of a circuit is not obtained at the time of formation of the circuit. After the electrical etching is performed, a metal plating is applied and the surface is subjected to rust proof treatment. An internal layer plate is formed with the circuit, the internal layer plate, a glass film, an epoxy, a prepreg and an external layer copper foil are laminated, are heated and pressed and are molded integrally. |
