发明名称 RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要 PURPOSE:To get a hardener abundant in fluidity, hardening property, and low in elastic modulus by having a polymaleimide compound, a polyaminosiloxane, and organic peroxide, which has activity within some range, and an inorgranic filler for its ingredients, and kneading these in some temperature range. CONSTITUTION:A composition, which has polyaminosiloxane shown by the formula by 10-50 pts.wt., an organic peroxide, which has the activity where the half-life at 180 deg.C is 0.2-2minutes, and an inorganic filler by 100-1500 pts.wt. to 100 pts.wt. of polymaleimide for its indispensable ingredients, is kneaded at 90 deg.C or less. Among the formula, R1 is some of CH3, C6H5, and R4NH2, and R2 is some of R5NH2, R5NHR6NH2, CH3, and C6H5, and at least either R1 or R2 has an amino group.
申请公布号 JPH05190707(A) 申请公布日期 1993.07.30
申请号 JP19920152362 申请日期 1992.06.11
申请人 MITSUBISHI KASEI CORP 发明人 TODA ATSUSHI;KIMURA MASATOSHI;SUZUKI OSAMU;YAMAMOTO MASAKI
分类号 C08G73/06;C08G73/12;C08K3/00;C08L33/24;C08L35/00;H01L23/29;H01L23/31 主分类号 C08G73/06
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