SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE: To extremely increase a pulse-shaped thermal load capacity further than in a conventional art, or to extremely decrease temperature further than in a conventional art in the case of the equivalent thermal load in a semiconductor device equipped with a semiconductor substrate whose lower surface is attached to a metallic substrate. CONSTITUTION: An auxiliary body 12 made of materials with large thermal conductivity working as a thermal buffer is attached to an upper face 11 of a semiconductor substrate 1, and a coupled layer 14 for guaranteeing extremely small heat transfer resistance is provided between the upper surface 11 of the semiconductor substrate 1 and the lower surface of the auxiliary body 12.