发明名称 MANUFACTURE OF LEAD FRAME FOR SEMICONDUCTOR DEVICE, AND LEAD FRAME FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEALED WITH RESIN
摘要 PURPOSE:To stack a plurality of individual lead frames with high positional accuracy and improve the productivity in assembling. CONSTITUTION:A gap 3 is provided between the fellow leads 1a and 1b to be stacked on top of the other and welded with each other, and the area including the gap 3 is welded, and one lead 1b is fused and cut off. Hereby, fused one lead coheres and separates at the section of the gap, so unnecessary parts such as a frame, etc., used in positioning can be cut off currently with the junction of the lead.
申请公布号 JPH05190720(A) 申请公布日期 1993.07.30
申请号 JP19920006522 申请日期 1992.01.17
申请人 HITACHI LTD 发明人 NISHIMURA ASAO;YAGUCHI AKIHIRO;HANEDA MITSUAKI;ANJO ICHIRO;ARITA JUNICHI;IWATANI AKIHIKO;ICHITANI MASAHIRO
分类号 B23K26/00;B23K26/20;H01L23/495;H01L23/50 主分类号 B23K26/00
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