| 摘要 |
PURPOSE:To obtain a thinner package by providing a frame with at least one pair of support leads which extend to the element from the opposite sides and support it from inside, with the resin thickness on the upper face of the conductor element the same as that of the lower face thereof for the prevention of cracking in the semiconductor element and the resin due to thermal stress, etc. CONSTITUTION:A semiconductor element 1 is mechanically held by four semiconductor element support leads 2 at the four corners. The inner part of a lead 3 is connected to a bonding pad 6 on the semiconductor element 1 through a bonding wire 5. The inner parts of the semiconductor element support leads 2 and those of the leads 3 are sealed using resin 4. The parts of the leads 3 outside the resin 4 are mechanically shaped into a desired lead form. The semiconductor element 1 is sealed using the resin 4. This requires no part to mount an element on, and thus, sealed is only a semiconductor element 1 only in the direction of thickness. The thickness of resin 4 is reduced, accordingly.
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