| 摘要 |
PURPOSE:To increase the yield rate in wire bonding and improve electrical characteristics. CONSTITUTION:A chip mounting pad 2 is provided to the surface of a substrate 1. A large number of wire bonding pads 3 are provided around the chip mounting pad 2. A circuit 4 is provided to the surface of the substrate 1 surrounding the chip mounting pad 2 between the chip mounting pad 2 and the wire bonding pads 3. An insulating film 5 is provided to the surface of the circuit 4 keeping a part of the circuit 4 exposed. A semiconductor chip 6 is mounted on the chip mounting pad 2. The electrode 7 of the semiconductor chip 6 is connected to the wire bonding pad 3 with a wire 8 which extends over the insulating film 5. The electrode 7 of the semiconductor chip 6 is connected to the exposed part 4a of the circuit 4 with wire 8. As the semiconductor chip 6 is connected to the exposed part 4a of the circuit 4, the wires 8 bonded between the semiconductor chip 6 and the wire bonding pads 3 can be lessened in number. |
